Our Services

Precision PCB design, simulation, and manufacturing liaison tailored for your toughest hardware challenges.

Core Engineering Competencies

  • Precision PCB Design: Multi-layer high-speed digital and precision analog layout, focusing on signal integrity and thermal management.

  • Hardware Reverse Engineering: Deconstructing complex multi-layer assemblies to reconstruct schematics, BOMs, and functional logic.

  • Mixed-Signal Systems: Expertise in bridging analog sensor data with digital processing, ideal for industrial monitoring and high-accuracy instrumentation.

Close-up of a complex multi-layer printed circuit board with intricate traces and components.
Close-up of a complex multi-layer printed circuit board with intricate traces and components.
Specialized Technological Domains

  • RF & Wireless Integration: Implementing mmWave, Wi-Fi, and LoRa protocols for robust communication in congested environments.

  • Embedded Systems Architecture: End-to-end development from microcontroller selection (ESP32, STM32, ARM) to firmware-hardware co-design.

  • Human Presence & Sensing: Advanced sensing arrays, including ToF (Time of Flight) and ultrasonic systems for automation and smart environments.

  • Functional FDM Prototyping: Utilizing industrial-grade polymers (ABS, PETG, Nylon) to create mechanical enclosures that fit your custom electronics perfectly.

  • Lab-to-Market Transition: Strategy consulting to help take a bench-top proof of concept through DFM (Design for Manufacturing) and into small-batch production.

  • Turnkey Hardware Solutions: Delivering a complete package—from the first schematic to the final 3D-printed and assembled unit.

Rapid Prototyping & Manufacturing
a close up of a small electronic device on a table
a close up of a small electronic device on a table
3D printer producing a prototype enclosure next to a detailed CAD model on a computer screen.
3D printer producing a prototype enclosure next to a detailed CAD model on a computer screen.